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- Credits of 40% of the value of equipment placed in service before 2025 with the credit decreasing by 10% each year until the end of 2025 after which it disappears. This includes any equipment, new construction, acquisition of equipment or upgrades that would incur depreciation or amortization including leases and lease extensions or renewals.
- Any property approved will receive a reduction in basis although new construction must be completed within 5 years.
- No credits or basis change will be issued for any equipment or items used outside of the US or in any way connected with the governments of China, Russia, Iran or North Korea.
- $10m/year will be allocated to advanced metrology for 3nm or above
- $10m/year will be allocated to metrology for security and supply chain verification (assumedly verifying imports and fakes)
- $30m/year will be allocated to developing a ‘manufacturing institute’ that will focus on research in virtualization and automation, advanced test, assembly, and packaging, and educational skills
- Various other ‘institutes’ will be developed and funded to foster ‘leadership’ in semiconductor R&D and packaging
- $50m/year will be allocated out of the DOD budget for R&D and development specifically for the semiconductor sector
- Innumerable studies, reports, and addresses to Congress, and the usual political ballyhoo will become part of the program’s oversight